Taiwan Starts TSMC Packaging Park
Taiwan broke ground on a new advanced packaging industrial park in Kaohsiung on Monday. TSMC will build two facilities for technology validation and talent training. The project supports growing global demand for artificial intelligence chips.
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Taiwan broke ground on an 88.7-hectare advanced packaging industrial park in Kaohsiung on Monday morning, anchored by Taiwan Semiconductor Manufacturing Co Ltd. The project expands southern manufacturing capacity as global artificial intelligence demand accelerates. TSMC will occupy two buildings at the Baipu Industrial Park to house a technology validation laboratory and a talent training centre, with operations scheduled to start in late 2029.
