Samsung Considers New Advanced Chip Packaging Plant
Samsung Electronics is reportedly planning a new semiconductor packaging facility in Gwangju to bolster its AI chip supply chain. The investment plan may be announced during a meeting with President Lee Jae Myung on June 29 as the company seeks to meet rising demand for high-bandwidth memory.
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SAMSUNG ELECTRONICS CO LTD is considering building an advanced semiconductor packaging facility in Gwangju to bolster its AI chip supply chain. The investment plan follows surging global demand for high-bandwidth memory (HBM) used in artificial intelligence servers. Securing advanced packaging capabilities is critical for Samsung to compete with rivals in the high-margin AI processor market.
