Samsung Plans $30B Expansion for Chip Packaging
South Korea President Lee Jae Myung announced that Samsung will invest heavily in advanced equipment following a new high-bandwidth memory chip packaging plant. The facility in Asan aims to meet surging server memory demand.
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South Korea President Lee Jae Myung announced that Samsung Electronics Co Ltd will pour 40 trillion won ($29.86 billion) into advanced equipment following a 6 trillion won investment in an HBM packaging plant. The expansion in Asan comes as memory makers race to capture surging demand for server infrastructure. The project accelerates national semiconductor initiatives backed by the government.
