Samsung to Use TSMC for Nvidia Chips
Samsung Electronics will reportedly use TSMC technology to produce base dies for Nvidia next-generation memory chips. The move marks a shift in manufacturing strategy for high-bandwidth memory development.
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SAMSUNG ELECTRONICS CO LTD will use TAIWAN SEMICONDUCTOR MANUFAC's 3-nanometre process to build base dies for NVIDIA CORP's custom high-bandwidth memory chips, a South Korea newspaper reported on Sunday morning. The agreement marks the first time Samsung has outsourced manufacturing stages for HBM production to the Taiwan contract chipmaker. Nvidia requested suppliers adopt the external manufacturing process to standardize implementation across memory vendors.
