GlobalFoundries In 2B TSMC AI Deal
GlobalFoundries has reached a 2 billion dollar agreement to manufacture key silicon interposers for TSMC at its New York facility. The five-year deal aims to ease advanced packaging constraints in AI chip production.
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GLOBALFOUNDRIES INC reached a $2B agreement on Thursday morning to manufacture silicon interposers for TAIWAN SEMICONDUCTOR MANUFAC at its New York plant. The five-year deal expands advanced packaging capacity to link AI processors and memory chips. Shares rose 4% in premarket trading following the announcement.
