CanSemi Seeks 918 Million in Shenzhen IPO

Chinese chipmaker CanSemi Technology aims to raise 918.5 million dollars through a Shenzhen initial public offering. The company plans to fund wafer production projects and working capital with the proceeds. Subscriptions for the offering open on Thursday.

Insights:

China chipmaker CanSemi Technology is seeking to raise 6.16 billion yuan ($918.5M) in an upcoming Shenzhen listing. The offering follows a share price set at 12.01 yuan, per a company filing released on Wednesday morning. The move comes as domestic semiconductor manufacturers accelerate funding rounds to expand domestic production capacity.

Expanding 12-Inch Wafer Output

IUX24

IUX24 AI-powered financial news and market intelligence. Think and act like smart money.

IFZA Properties, Dubai Silicon Oasis, DSO-IFZA, Dubai, United Arab Emirates

Copyright IUX24 MEDIA - FZCO. All rights reserved.

Powered by AI • Made with precision

IUX24 is an information and analytics platform providing news, market data, analytical tools, and AI-powered features for informational and educational purposes. The Services and information provided do not constitute investment advice, trading signals, or brokerage services. Investing involves risk, and Users should carefully evaluate information before making investment decisions.