Wolfspeed Gets 1.5 Billion Dollar US Loan

Chipmaker Wolfspeed has received a conditional loan commitment of up to 1.5 billion dollars from the US Department of Defense. The funding aims to expand domestic production of advanced silicon carbide materials and power devices.

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U.S. power chip maker Wolfspeed’s silicon carbide 200mm wafer is seen on display at Wolfspeed’s Mohawk Valley Fab in Marcy, New York, U.S., April 2022. Courtesy of Wolfspeed/Handout via REUTERS/File Photo

WOLFSPEED INC secured a conditional loan commitment of up to $1.5 billion from the United States Department of Defense, sending its shares surging 27% in extended trading on Wednesday evening.

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