Besi Shares Drop on ASML Rival Product Report
Shares of Besi fell after a research report indicated that semiconductor giant ASML is developing a rival hybrid bonding product. The advanced packaging technology is a key growth driver for Besi, though ASML has not yet confirmed the development.
Insights:
BE Semiconductor Industries shares fell 3% to €158.50 in midday trading on Friday after a SemiAnalysis report indicated ASML is developing a rival hybrid bonding tool. The research firm analyzed 27 patent filings from the larger equipment maker, pointing to potential competition for one of Besi's primary growth products. The development threatens Besi's market position as a leader in hybrid bonding, an advanced packaging technology used to manufacture 3D chips.
