Lam Research opens Austria lab for chip packaging tech
The U.S. chipmaking tools supplier has launched a research facility in Salzburg to focus on panel-level packaging. This technology uses square panels instead of traditional circular wafers to increase chip density and lower production costs as global demand for AI processors continues to rise.
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LAM RESEARCH CORP opened a research laboratory in Austria on Wednesday afternoon to advance panel-level chip packaging technology. The facility leverages expertise from Semsysco GmbH, a Salzburg-based firm acquired by the U.S. equipment supplier in 2022. Transitioning to square panels reduces material waste at wafer edges, lowering production costs as AI demand strains global supply.
