Intel and 3DGS to Build 3.3 Billion Dollar India Plant
Intel and 3DGS Inc. USA will invest 3.3 billion dollars to establish a substrate manufacturing facility in Odisha, India. The project aims to create 1,800 high-skilled jobs while focusing on advanced packaging glass core substrates and semiconductor technologies.
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INTEL CORP and 3DGS Inc. will invest $3.3B to build a semiconductor substrate plant in Odisha, India. The project aligns with New Delhi's multi-billion dollar subsidy program to expand local electronics manufacturing. The facility supports advanced packaging supply chain development for chip production.
