Samsung Electronics to Start Next Generation HBM4 Chip Production for Nvidia and AMD

Samsung Electronics will start HBM4 production next month to supply Nvidia and AMD after passing qualification tests for next-generation AI memory components.

洞察:
Samsung Electronics Co., Ltd. announced plans to begin production of high-bandwidth memory (HBM4) chips next month. The company, which is headquartered in KR KRKR, confirmed that it will supply these new components to NVIDIA Corporation following the successful completion of qualification tests. This development signifies a major expansion in the manufacturing capabilities of Samsung Electronics Co., Ltd.as it enters the next-generation memory market for artificial intelligence.
Samsung Electronics HBM4, a sixth-generation high-bandwidth memory solution for AI and HPC applications, is displayed during the 2025 Korea Tech Festival in Seoul, South Korea, December 4, 2025. REUTERS/Kim Hong-Ji/File Photo
Samsung Electronics HBM4, a sixth-generation high-bandwidth memory solution for AI and HPC applications, is displayed during the 2025 Korea Tech Festival in Seoul, South Korea, December 4, 2025. REUTERS/Kim Hong-Ji/File Photo
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