Lam Research and Applied Materials eye BESI acquisition

BESI is evaluating takeover interest from Lam Research and Applied Materials. The move follows rising demand for advanced chip packaging used in AI systems.

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BE SEMICONDUCTOR INDUSTRIES is reportedly fielding takeover interest as its advanced chip-packaging technology becomes increasingly vital for the global semiconductor equipment market. Based in the Netherlands, the company is currently valued at approximately 14 billion euros ($16.2 billion). To evaluate these strategic approaches, the firm has engaged Morgan Stanley as its financial advisor. Among the primary interested parties is the United States-based Lam Research Corporation, which has reportedly held discussions with the Dutch equipment maker. Another significant contender is Applied Materials, Inc., which already holds a 9% stake in the company as of April last year, making it the largest shareholder. The two firms have a long-standing partnership focused on hybrid bonding technology, which is essential for high-speed data transfer and lower power consumption in next-generation chips. While discussions began in mid-2025, they faced a temporary pause earlier this year due to diplomatic tensions between Washington and the European Union. Any potential acquisition of a Dutch firm holding strategic semiconductor technology would likely trigger a rigorous national security review. Regarding the potential for a full buyout, Degroof Petercam analyst Michael Roeg noted the market's expectations for the existing partnership. > BESI shareholders will assume that Applied Materials will eventually want to buy the entire company. BE Semiconductor Industries had previously stated in 2024 that it remained committed to its strategy as an independent entity. However, the surge in demand for artificial intelligence and high-performance computing has turned advanced packaging into a critical industry bottleneck, significantly increasing the strategic value of the firm's intellectual property.

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